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CONTENTS

1

FEATURES

1.1

General

1.2

Multiple format data interface

1.3

DAC digital sound processing

1.4

Advanced audio configuration

2

GENERAL DESCRIPTION

3

ORDERING INFORMATION

4

QUICK REFERENCE DATA

5

BLOCK DIAGRAM

6

PINNING

7

FUNCTIONAL DESCRIPTION

7.1

System clock

7.2

Pin compatibility

7.3

Analog front end

7.4

Programmable Gain Amplifier (PGA)

7.5

Analog-to-Digital Converter (ADC)

7.6

Digital Automatic Gain Control (AGC)

7.7

AGC status detection

7.8

Digital mixer

7.9

Decimation filter (ADC)

7.10

Overload detection (ADC)

7.11

Mute (ADC)

7.12

Interpolation filter (DAC)

7.13

Peak detector

7.14

Quick mute

7.15

Noise shaper (DAC)

7.16

Filter Stream Digital-to-Analog Converter

(FSDAC)

7.17

Multiple format input/output interface

7.18

L3-interface

7.19

Address mode

7.20

Data transfer mode

7.21

Programming the sound processing and other

features

7.21.1

STATUS control

7.21.2

DATA0 direct control

7.21.3

DATA0 extended programming registers

7.21.4

DATA1 control

16 17

NXP Semiconductors

Economy audio CODEC for MiniDisc (MD) home stereo and portable applications

8 9 10 11 12 13 14 15 15.1

15.2 15.3 15.4 15.5

2002 May 16

2

Product specification

UDA1341TS

LIMITING VALUES THERMAL CHARACTERISTICS DC CHARACTERISTICS AC CHARACTERISTICS (ANALOG) AC CHARACTERISTICS (DIGITAL) APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING

Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods

DATA SHEET STATUS DISCLAIMERS

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