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NXP Semiconductors

Economy audio CODEC for MiniDisc (MD) home stereo and portable applications

14 PACKAGE OUTLINE SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

D

c

y

Z

28

15

A

2

A

1

pin 1 index

1

14

wM

e

b

p

  • 0

    2.5

scale

5 mm

DIMENSIONS (mm are the original dimensions)

UNIT

A max.

A1

mm

2

0.21 0.05

1.80

0.25

0.38

0.20

10.4

1.65

0.25

0.09

10.0

A2

A

3

bp

c

D

(1)

E

(1)

5.4 5.2

e

0.65

HE

L

Lp

7.9

1.25

1.03

7.6

0.63

Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

OUTLINE

REFERENCES

VERSION

IEC

JEDEC JEITA

SOT341-1

MO-150

2002 May 16

29

E

H

E

Q

( A ) 3

L

p

L

detail X

Q

0.9 0.7

v

w

0.2

0.13

EUROPEAN PROJECTION

Product specification

UDA1341TS

SOT341-1

A

X

vM A

A

θ

y

0.1

Z

(1)

1.1 0.7

8

o

0

o

θ

ISSUE DATE

99-12-27 03-02-19

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