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Molecular Electronics Past, Present, Future? - page 3 / 33

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Silicon and Moore’s Law

Heat dissipation.

At present, a state-of-the-art  500 MHz microprocessor with 10 million transistors emits almost 100 watts--more heat than a stove-top cooking surface.

Leakage from one device to another.

The band structure in silicon provides a wide range of allowable electron energies. Some electrons can gain sufficient energy to hop from one device to another, especially when they are closely packed.

Capacitive coupling between components.

Fabrication methods (Photolithography).

Device size is limited by diffraction to about one half the wavelength of the light used in the lithographic process.

‘Silicon Wall.’

At 50 nm and smaller it is not possible to dope silicon uniformly. (This is the end of the line for bulk behavior.)

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