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SME Specific MeasuresCompetitive and Sustainable Growth

Exploratory Award

Proposal number EXAW-1999-01377

AcronymMEOS

Proposal title3-D In-line inspection using microstrip sensors

AbstractThis project aims to produce a new inspection technique for soldered joints on Printed

Circuit Board assemblies using X-ray inspection and 3-D image analysis. The continuity

of soldered connections on printed circuit board (PCB) assemblies  is of paramount

importance in ensuring the reliability of almost any electronic device. The need exists

for a fast, reliable QA testing methodology, which will increase reliability and reduce

manufacture time of PCBs . The opportunity exists to use 3-D X-ray visualisation

technology, presently being  developed in the medical field, to produce a non-contact,

once-through x-ray scanning system capable of detecting flaws in multi-layer PCB

assemblies by comparing the manufactured device with an image of a "perfect model" .

Key ActionGROW-6.   RTD activities of a generic nature : Measurement and testing

Start date20/12/2000End date20/12/2001

Intended Step 2 projectCooperative Research (CRAFT)Duration Exploratory Phase12 months

SME CoordinatorMr. Nicholas FOXCompany sizeS2

BAGGAGE SCAN LIMITED

Nottingham Business Park, City Link, The Island Business District

NG2 4LA - Nottingham

United Kingdom

Phone: 01158484957

Fax: 01158484959

Email: n.fox@ish.co.uk

Internet: www.ish.co.uk

SME Proposer(s)

ANCO S.A. AGENCIES, COMMERCE AND INDUSTRYGreeceS4

Profile of partners for joining the project

Business areas31 - Manufacture of electrical machinery and apparatus n.e.c.

32 - Manufacture of radio, television and communication equipment and apparatus

33 - Manufacture of medical, precision and optical instruments, watches and clocks

29 - Manufacture of machinery and equipment n.e.c.

Comments

Last update18/6/2001

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