NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing
Solvent Modified Cleans e.g. EG-BOE
Residues after metal etch processes often contain compounds of the metal etched, along with other species.
Cleaners contain fluoride and a polar solvent such as ethylene glycol to dissolve these metallic compounds.
Involves a balance of acidity and etching of the fluoride with the inhibition of metal attack by ethylene glycol