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Thomas S. Roche, Ph.D. Motorola Corporation  1999 Arizona Board of Regents for The University of ... - page 39 / 47

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Roche

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NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing

Post-Etch Cleans

Reactive ion etching (RIE) = a physical-chemical process which can leave residues  

Difficult to remove (can be fluorinated polymers) so both ash and wet clean are usually used

Residues are created to inhibit attack of the plasma on the sidewall of the etched film

Changes in the etch process or the material being etched can require changes in the clean

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