Electrical Testing for Counterfeit Detection
Mark Marshall VP Engineering Integra Technologies LLC (316) 630-6812 (Phone and Fax) Email: Mark.email@example.com
Integra Technologies has had over 25 years experience testing and qualifying Integrated Circuit components both for IC manufacturers and military and space users of devices. In recent years there has been a dramatic increase in the occurrence of counterfeit components creating a need for efficient methods to detect them. Electrical test has become one of the important methods used in the evaluation of counterfeit devices, however there is often confusion about how much testing is needed and how testing requirements are communicated.
The presentation will describe various testing strategies used in detecting counterfeit parts and will provide actual examples and experiences with identified counterfeit parts. Electrical test will be further discussed including descriptions of effective methods to implement electrical test and cost trade-offs with test coverage. Cost effective electrical test methods will be shown that can provide a reasonably high assurance of detecting counterfeit parts. Also covered will be different types of counterfeit devices and the test methods required to detect them. Finally some discussion will be included on problems with broker directed component screening.
Mr. Marshall has degree in Electrical Engineering and has been working in the field of electronic component evaluation for over 25 years. He has expertise in the evaluation, testing and qualification of Integrated Circuits. He has extensive experience in Integrated Circuit component management and played a key role in setting supplier strategies for NCR, AT&T and Lucent. Mark currently is the Vice President of Engineering at Integra Technologies where he is responsible for the test engineering development group. Integra’s engineering staff has expertise in many fields of test including microprocessors, memories, ASIC’s, RF and mixed signal as well as expertise in qualification and environmental stressing of components.
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