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Chip Resistor Surface Mount

YC/TC

SERIES

164 (RoHS Compliant)

TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements

TEST Life/

TEST METHOD MIL-STD-202G-method 108A

PROCEDURE 1,000 hours at 70±5 °C applied RCWV

Operational Life/ Endurance

IEC 60115-1 4.25.1 JIS C 5202-7.10

1.5 hours on, 0.5 hour off, still air required

High Temperature Exposure/ Endurance at upper category temperature

MIL-STD-202G-method 108A IEC 60115-1 4.25.3 JIS C 5202-7.11

1,000 hours at maximum operating temperature depending on specification, unpowered

No direct impingement of forced air to the parts Tolerances: 155±3 °C

Moisture Resistance

MIL-STD-202G-method 106F IEC 60115-1 4.24.2

Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered

Parts mounted on test-boards, without condensation on parts

Measurement at 24±2 hours after test conclusion

Thermal Shock

MIL-STD-202G-method 107G

  • -

    55/+155 °C

Note: Number of cycles required is 300. Devices unmounted

Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air – Air

Short time overload

MIL-R-55342D-para 4.7.5 IEC60115-1 4.13

2.5 times RCWV or maximum overload voltage whichever is less for 5 sec at room temperature

Board Flex/ Bending

IEC60115-1 4.33

Device mounted on PCB test board as described, only 1 board bending required

3 mm bending Bending time: 60±5 seconds Ohmic value checked during bending

Oct 27, 2008 V.3

Product specification

6

8

REQUIREMENTS

±(2%+0.05 ) <100 mfor Jumper

±(1%+0.05 ) <50 mfor Jumper

±(2%+0.05 ) <100 mfor Jumper

±(0.5%+0.05 ) for 10 Kto 10 M

±(1%+0.05 ) for others <50 mfor Jumper

±(2%+0.05 ) <50 mfor Jumper No visible damage

±(1%+0.05 ) <50 mfor Jumper No visible damage

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