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Chip Resistor Surface Mount

TEST

TEST METHOD

Solderability - Wetting

IPC/JEDECJ-STD-002B test B IEC 60068-2-58

- Leaching

IPC/JEDECJ-STD-002B test D IEC 60068-2-58

- Resistance to Soldering Heat

MIL-STD-202G-method 210F IEC 60068-2-58

Oct 27, 2008 V.3

YC/TC

SERIES

164 (RoHS Compliant)

PROCEDURE

Electrical Test not required Magnification 50X SMD conditions:

1 s t s t e p : m e t h o d B , a g i n g 4 h o u r s a t 1 5 5 ° C dry heat

2

nd

step: leadfree solder bath at 245±3 °C

Dipping time: 3±0.5 seconds

Leadfree solder, 260 °C, 30 seconds immersion time

Condition B, no pre-heat of samples

Leadfree solder, 270 °C, 10 seconds immersion time

Procedure 2 for SMD: devices fluxed and cleaned with isopropanol

Product specification

7

8

REQUIREMENTS

Well tinned (95% covered) No visible damage

No visible damage

±(1%+0.05 ) <50 mfor Jumper No visible damage

www.yageo.com

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