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Packaging Materials Today

Alpha Emission Rates for Curr ent Packaging Mater ials (counts/kh/cm2)

Packag e T yp e

Mold Compound

Underfill

Solder Bumps

Terrestrial Component (neutrons/khr/cm2)

QFP

20

NA

NA

60k -120k

Flip Chip packaging materials adjacent to devices have the lowest alpha emission materials in the industry today

Lead free interconnect materials (current Sn/Pb solder bump alternative) for flip chip bump is being evaluated. This will eliminate the lead based source upsets. Trace impurities in these new materials will contribute to emission at a much lower level than the current low alpha leads.

Currently all PBGA mold compound and encapsulant base epoxies have lower alpha emission rates. Fused Silica fillers (60 to 80% by volume) are added to the base epoxy and are the main contributors for alpha emission (20 c/khr/cm2). Low alpha filler choices (1 c/khr/cm2)are also available and will be evaluated for manufacturability and reliability.

NA

6 0 k -12 0 k

PBGA

Flip Chip PBGA

20 (1 for low alpha MC)

NA

1

NA

10 (Low Alpha Solder)

6 0 K -12 0 k

Presentation Name 76

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