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18

AUTOMOTIVE ELECTRONIC DESIGN

was supported in part by Parades, the Gigascale Silicon Research Center, and the IST Columbus Project of the European Community.

References

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    H. Jones, Monthly Report on Semiconductor Industry, Jan. 2003, International Business Strategies, Inc.

  • 2.

    OSEK, www.osek-vdx.org.

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    MathWorks/Simulink, www.mathworks.com.

  • 4.

    ETAS ASCET-SD Homepage, www.etas.de.

  • 5.

    P. Giusto et al., “Automotive Virtual Integra- tion Platforms: Why’s, What’s, and How’s,” Proc. Int’l Conf. Computer Design (ICCD 02), IEEE CS Press, 2002, pp. 370-378.

  • 6.

    G. Bombarda, G. Gaviani, and P. Marceca, Power-Train System Design: Functional and Architectural Specifications, SAE Tech. Paper 2000-01-C049, Society of Automotive Engineers, 2000.

  • 7.

    Cadence Design Systems, Virtual Compo-

nent Codesign (VCC), www.cadence.com. 8. A. Ferrari et al., The Design and Implementation of a Dual-Core Platform for Power-Train Systems, SAE Tech. Paper 2000-01-C050, Society of Automotive Engineers, 2000.

Alberto Sangiovanni-Vincentelli is a guest editor of this issue. His biography appears on page 9.

Direct questions and comments about this article to Alberto Sangiovanni-Vincentelli, University of California at Berkele , 515 Cory Hall, Berkeley, CA 94720-1770; alberto@ eecs.berkeley.edu.

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