12 / JANUARY 2005
(Continued from page 11) Ran Soffer, Marketing Director
4 Shenkar St., POB 12297 Herzlia 46733, Israel Phone: +972 9 950-5434 Fax: +972 9 950-5683
Quantum Leap Packaging was formed in December 2002 to develop electron- ic component packaging utilizing a proprietary Liquid Crystal Polymer (LCP) compound. The company re- ceived $3.5M in Series A financing from Battery Ventures. In the summer of 2004, Quantum Leap closed a $6.5M Series B round of funding led by Battery Ventures and including pri- vate investors. In addition, Comerica Bank committed $2.5M in debt financ- ing to support expansion of Quantum Leap’s manufacturing operations. The company plans to seek additional cap- ital in late 2005 or early 2006 and an- ticipated breakeven in 2006. The company’s original startup team of four has grown to 25 employees.
When semiconductor, microwave, op- tical and medical devices require im- proved thermal performance, increased electrical performance and precision molding, or fall into the category of MEMS, specialized component pack- aging is required. However, Quantum Leap argues that there has been little innovation in the high performance packaging field. Today’s solutions con- sist of traditional ceramic and metal component packages, which are very costly.
To address this market opportunity, Quantum Leap has developed patent- ed Liquid Crystal Polymer (LCP) ma- terials as a replacement for the more costly and traditional ceramic and metal component packaging. Other key areas of innovation include package design and lid sealing technology. LCP
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packages can be manufactured by in- jection molding technology, which provides several advantages, including extremely fast cycle time, high levels of automation and efficient utilization of substrates.
Quantum Leap’s liquid crystal polymer (LCP) technologies will withstand temperatures of over 400°C and are three times as tough as conventional LCPs. Tests show that LCP has higher reliability than today’s standard mate- rials such as metal and ceramic. Injec- tion moldable LCP features lower dielectric constant and loss properties than ceramic and epoxies, which re- sults in better high frequency perfor- mance. It experiences slow outgassing and has lower moisture absorption than convention (OCN) and biphenyl ep- oxies providing higher reliability. It also has lower mold shrinkage than epoxies. LCP does not go through a glass transition temperature, support- ing better dimensional stability than typical overmolded epoxies.
ages, which is an industry first. Lids can be attached conventionally with B stage epoxy or using Quantum Leap’s UltraSealTM for stronger seals, better barriers and shorter manufacturing times. UltrasealTM technology produc- es a hermetic seal in less than two sec- onds, a marked improvement over the one-hour cure cycle required by epoxy. The Ultraseal process is stronger than epoxy methods, eliminating the prob- lem of epoxy flow and out-gassing, which can adversely affect reliability.
With Quantum Leap’s proprietary LCP, the degree and direction of the Coefficient of Thermal Expansion (CTE) can be very tightly controlled, ensuring mechanical stability. Further- more, the CTE can be tailored to match more efficient heat sink alloys, result- ing in a significant improvement in heat dissipation and MTTF of the to- tal assembly. The use of copper versus copper tungsten or alloy 42 allows improved electrical and thermal per- formance.
The combination of its high tempera- ture, low weight and low flammability characteristics, together with its low cost allow Quantum Leap’s LCP to address a variety of applications where conventional polymers could never be considered. When used as a packag- ing replacement for traditional metal or ceramic materials, Quantum Leap’s LCP material system delivers multiple benefits such as accelerated cycle time, high levels of automation and signifi- cant cost reduction with no sacrifice to performance. Target applications include semiconductors, medical, op- tical devices, RF-Microwave, LD- MOS, vision and MEMS either in hermetic or non-hermetic configura- tions.
Quantum Leap’s LCP material, when utilized in their proprietary molding process, supports high temperature applications while adding mil-spec hermeticity to plastic air cavity pack-
The structural properties of LCP make it possible to mold complex packages with thin walls while holding extreme- ly tight tolerances, enabling the insert molding of “air cavity” packaging for applications such as vision packaging, LDMOS, Saw devices, Oscillators, RF wireless and MEMS. The thin wall construction provides more area inside the air cavity package for the active and passive components, while maintain- ing the industry standard footprints common to ceramic and metal pack- ages. With availability in strip form, LCP RF power packages facilitate au- tomated assembly, further lowing costs.
The initial application for Quantum Leap’s LCP is semiconductor and elec- tronics packaging, where the need for high temperature eutectic soldering, mechanical robustness and dimension stability demanded the use of inorgan- ic packaging materials such as metal
ommunications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA Fax 781.647.8825 www.pinestream.com email@example.com