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pins, crystals and PLLs. And it con- sumes 30% to 50% less power than phase-locked approaches.

The Copernicus Clocking Solution can meet the specification of nearly any application with the exception of fre- quency synthesis for RF communica- tions. The solution is silicon proven in TSMC 0.18µm CMOS with a silicon footprint of less than 0.3mm2 and can be ported to any process technology for any operation frequency range up to 1GHz.

Copernicus has been silicon proven in a mixed-signal 16-bit microcontroller for sensor data acquisition. In this ap- plication, the Copernicus clocking so- lution occupied roughly 3% of the total die area, did not does not require any PLL, XTAL or external pins, features <300ppm RMS jitter, operates from 2kHZ to 66MHz in discrete steps with +/- 0.75% accuracy, provides instan- taneous frequency switching and pro- vides system boot from the monolithic clock.

According to Mobius, no other IP sup- plier offers monolithic clock solutions. Some exotic, MEMS-based solutions exist in the market, but none that ad- dress Mobius’ sweet spot, which is ceramic resonator replacement. Coper- nicus is ideally suited to low-cost mi- crocontroller-based ICs, where off-chip clock components can equal, if not exceed, the price of the chip.

The company currently has two cus- tomers who are using Copernicus in a USB controller and microprocessor platform. In addition to TSMC, Coper- nicus has been silicon proven at Char- tered (0.35u CMOS) and IBM (0.18u CMOS). Based on its target market, most of the applications for Coperni- cus do not require leading edge pro- cesses, although the technology can scale to 0.13u and beyond.

Future plans include ongoing Coper- nicus development as well as a com- plete system level IP platform for an undisclosed application, which coin- cides with the current fund-raising ef- forts.

Michael McCorquodale, Ph. D., co- founder, CEO & CTO (previously managed communication system engineering activities for NASA sat- ellite subsystems and developing InP and SiGe ICs at Hughes Space and Communications)

Jeffrey Wilkins, COO (previously worked in the Corporate Banking Group at Huntington National Bank in Columbus, Ohio and worked at Velocys, a spin-off of the Battelle Memorial Institute)

James Vincke, CFO (previously worked at Mechanical Dynamics, a virtual prototyping of mechanical systems software company)

28 W Adams Ave., Ste 1600 Grand Park Centre Detroit, MI 48226 Tel: 313.420.5400 Fax: 313.420.5404 www.mobiusmicro.com


PolyIC GmbH & Co. KG was formed in November 2003 as joint venture be- tween Leonhard Kurz (51%, print- ing) and Siemens (49%, electron- ics) to develop printed polymer electronics. Sie- mens holds a leading position in the field of polymer electron- ics while Leon- hard Kurz has expertise in print- ing and coating

films and foils. In the new joint ven- ture, specialists from both companies will be working on polymer chips and their industrial production. PolyIC is headquartered in Erlangen, at the Sie- mens Research Centre. The company has roughly 24 employees in addition to people working on the technology at the company’s collaborating share- holders Kurz & Siemens.

PolyIC uses its competence on materi- als, new adapted chip design methods and mass production processes (roll-to- roll printing) for the development of polymer (organic) electronics technol- ogy and printed electronic products and components.

Copyright Pinestream Communications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA Tel 781.647.8800 Fax 781.647.8825 www.pinestream.com info@pinestream.com

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