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Data sheet acquired from Harris Semiconductor - page 8 / 17

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PACKAGE MATERIALS INFORMATION

www.ti.com

26-Jan-2013

TAPE AND REEL INFORMATION

CD40106BM96

SOIC

D

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

CD40106BM96G4

SOIC

D

14

2500

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

CD40106BMT

SOIC

D

14

250

330.0

16.4

6.5

9.0

2.1

8.0

16.0

Q1

CD40106BNSR

SO

NS

14

2000

330.0

16.4

8.2

10.5

2.5

12.0

16.0

Q1

CD40106BPWR

TSSOP

PW

14

2000

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

Pack Materials-Page 1

Reel

Reel

Diameter

Width

(mm)

W1 (mm)

A0

B0

K0

P1

W Pin1

(mm)

(mm)

(mm)

(mm)

(mm) Quadrant

SPQ

*All dimensions are nominal Device

Package Package Pins

Type

Drawing

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