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Data sheet acquired from Harris Semiconductor - page 9 / 17

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PACKAGE MATERIALS INFORMATION

www.ti.com

26-Jan-2013

*All dimensions are nominal Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

CD40106BM96 CD40106BM96G4 CD40106BMT CD40106BNSR CD40106BPWR

SOIC SOIC SOIC SO TSSOP

D D D NS PW

14 14 14 14 14

2500 2500 250 2000 2000

367.0 367.0 367.0 367.0 367.0

367.0 367.0 367.0 367.0 367.0

38.0 38.0 38.0 38.0 35.0

Pack Materials-Page 2

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