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Sockets for memory card

AXA2R PRODUCT TYPES

Standoff height (mm)

Part No.

0 1. 5 0 1.5 0 1.5 0 1.5

AXA2R73061AXA2R73361AXA2R63061AXA2R63361AXA2R73021AXA2R73321AXA2R63021AXA2R63321

Product

Eject type

Card detection

name

switch

Inner carton

Asterisk “ ” mark on end of Part No.; P: 350 pieces (1 reel)

(Embossed tape package) T: 35 pieces (1 tray)

(Tray package)

Asterisk “ ” mark on end of Part No.; P: 700 pieces (2 reels)

(Embossed tape package) T: 700 pieces (20 trays)

(Tray package)

Packing quantity

Outer carton

Sockets for SD memory card (R type)

Push-push type

Available

Card jump-out prevention function

Mounting type

Available

Standard mounting type

Reverse mounting type

Not available

Standard mounting type

Reverse mounting type

SPECIFICATIONS

1. Characteristics

Item Rated Current

0.5 A/1 terminal

Specifications

Condition

Electrical characteristics

Contact resistance

Insulation resistance

Signal contact portion: Max. 100m(Initial) Detection contact portion: Max. 150m(Initial) (Card detection and write protection detection)

Min. 1,000M(Initial)

Measured based on the HP4338B measurement method of JIS C5402

Using 500V DC megger (applied for 1 min.)

Breakdown voltage

Mechanical characteristics

Vibration resistance

Card insertion force Card removal force

Lifetime characteristics

Insertion and removal life of card

Ambient temperature

Storage temperature

Environmental characteristics

Resistance to soldering heat

Humidity tolerance (mated condition)

500V AC for 1 min.

Frequency: 10 to 55 Hz Acceleration: 20.0 m/s2 {2.0G} No current interruption for more than 0.1 µs

Max. 40N Min. 1N, Max. 40N

Insertion and removal life: 10,000 times

Contact resistance after testing: Signal contact portion: Max. 100mDetection contact portion: Max. 150m(Card detection and write protection detection)

  • 25°C to +90°C

  • 40°C to +90°C (The allowable storage temperature is –40°C to +50°C

if unopened from original packaging)

Reflow soldering: peak temperature 250°C or less Hand soldering: Soldering iron temperature 300°C, 5 sec. or less

Contact resistance: Signal contact portion: Max. 100mDetection contact portion: Max. 150m(Card detection and write protection detection) Insulation resistance: Min. 100 M

Rated voltage is applied for one minute and check for short circuit or damage with a detection current of 1 mA.

Insertion and removal speed are at a rate of 600 times/hour or less.

No freezing or condensation in low temperatures

No freezing or condensation in low temperatures

Sockets (shell) surface temperature for using infrared reflow soldering machine

MIL-STD-1344A, METHOD 1002 Temperature: 40±2°C, Humidity: 90 to 95%RH, Test time: 500 hours

Applicable memory card Unit weight

SD memory card*1 2.9g

Note: *1. The above characteristics cannot be guaranteed when a card other than the specified ones is used.

2. Material and surface treatment

Portion

Signal contact

Detection contact Retention solder tab

Copper alloy

Contact portion: Ni plating on base, PdNi plating + Au flash plating Soldering portion: Ni plating on base, Au plating on surface

Stainless steel

Contact/Soldering portion: Ni plating on base, Au plating on surface Soldering portion: Ni strike, Partial Au plating

Material

Surface

panasonic-electric-works.net/ac

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