EMBOSSED TAPE AND REEL (Unit: mm)
Socket for SD memory card
Emboss carrier tape
Top cover tape
165° to 180°
Reel dimensions (Conforming to JIS C0806-1995)
Top cover tape
Emboss carrier tape
1.Regarding the design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas.
Regarding the socket mounting
When reflow soldering when the slider
is locked, heat will cause the slider to deform and not work. Therefore, please confirm that the slider lock is released before mounting if you have inserted and removed a card before soldering. 2) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations.
Screen-printing method is
recommended for cream solder printing. (2) Use the recommended foot pattern for cream solder printing (screen thickness:
The metal mask opening ratio for the
COM contact (one) and NO contacts (two) must be 75%. (4) When applying the different thickness of a screen, please consult us. (5) The following diagram shows the recommended reflow soldering temperature profile. The recommended conditions for the reflow temperature profile
Temperature 250°C max.
180 to 200°C
155 to 165°C
60 to 120 sec.
Within 30 sec.
(6) Measure the temperature at the connector surface. (7) If the reverse side of the board undergoes reflow soldering after the socket is reflow-soldered, fix the socket with tape or adhesive; otherwise, the socket may drop. The socket can withstand two iterations of reflow soldering.
Set the soldering tip to 300°C, and
solder for no more than 5 seconds.
Be aware that for the 0 mm standoff
type, solder creeping at the retention solder tab sections may occur if soldering is conducted for long periods or if too much solder is used. 4. Cleaning after soldering Inside the socket there is a slider section and card detection contact/write protection mechanism. If anything such as flux remains inside after washing, insertion and removal will be hampered and contact will be faulty. Therefore, do not use methods that involve submersion when cleaning. (Partial cleaning of the PC board and soldered terminals is possible.)
After PC board mounting
Warping of the PC board should be no
more than 0.03 mm for the entire connector length. 2) When assembling PC boards or storing them in block assemblies, make sure that undue weight is not exerted on a stacked socket. 3) Be sure not to allow external pressure to act on sockets when assembling PC boards or moving in block assemblies.
Handling single components
Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because excessive force applied to the terminals will cause deformation and loss of terminal coplanarity. 3) Repeated bending of the terminals may break them.
These products are made for the
design of compact and lightweight devices and therefore the molded part is very thin. For this reason, design the device to prevent undue wrenching forces from being applied to the product during use. 2) The sockets are constructed to prevent reverse card insertion. Caution is required because repeated, mistaken reverse insertion may damage the socket and card. 3) When not soldered, be careful not to insert and remove the socket’s card. Doing so will cause a decrease in anchoring ability of the molded part and loss of coplanarity. 4) Forcibly removing a fitted card may degrade the card removal prevention lock. To remove a card, be sure to push the card in the insertion direction to release the slider lock before pulling out the card. 5) Please include notes to the following effect in your user manuals. 6) The card ejection protection lock does not work for MMC. 7) The socket does not have a wrong insertion protection structure for MMC. Be careful about the insertion direction. 8) If an MMC is inserted, it is possible that a short circuit between the socket’s signal contacts No. 7 and 8 and the MMC’s contact No. 7 may be caused.
Sockets for memory card