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NEW Location


Wednesday, May 23 - Friday, May 25, 2007 Indian Lakes Resort, Bloomingdale, IL

This years

convention is once again the result of listening to our memberships

input. You have

spoken and we have reacted to the overwhelming desire to conduct our meetings in a new and improved location. We will be holding our Annual Convention and Scholarship Golf Outing at the Indian Lakes Resort in Bloomindale, IL, located just 35 minutes from Chicago. The resort offers amenities unlike the other locations we visited for the May meetings of the past. We are fortunate to be conducting the Golf Outing on the same property where our Seminar will be held, a premier resort featuring over 300 newly renovated rooms and on-site dining choices unlike no other hotel we visited. Featuring over six restaurants and lounges right on site, you can have great food, fun, and entertainment without ever leaving the resort. The convention facilities provide us with more space for all of our functions and the hotel has the ability to support our continued growth in attendance at our meetings and display showcase which follows the

seminar content.

Your committee has once again developed a comprehensive agenda comprising topics relating to technological advances, new product introductions, canmaking, environmental matters, and market studies. Our format of having Thursday morning as a general session with our membership meeting, award presentations, and motivational speaker remains as last year. After networking during the luncheon time we will conduct our Breakout Sessions on flat sheet and two-piece printing technology. Following our seminar on Thursday, our sponsors will host the Display Showcase and conduct a hospitality session for the enjoyment of the attendees. Our conference will continue on Friday morning with emphasis on packaging developments. On both days our Keynote Speakers will talk to us about the changes being made in packaging developments and the effects of those changes in the marketplace. Your committee feels that the content of the conference will satisfy your need to embrace new technology while enjoying the camaraderie our industry has to offer. We hope to see you in Chicago from May 23-25, 2007.


Our support for education continues! We will once again sponsor a Scholarship Golf Outing; the proceeds from the outing support our IMDA Scholarship Fund. These funds are awarded to our members’ children and grandchildren who will continue their pursuit of learning at the college level.

200 golfers will enjoy the camaraderie and sportsmanship of fellow metal decorators, as they play the holes on the Indian Lakes Resort Golf Courses. Upon the conclusion of the play, we will host our ever-popular banquet that evening, which has been a fun-filled and rewarding event over the years. During the banquet, we will recognize those golfers for their achievements on the course that day. The banquet is also open to those who choose not to play golf, but want to share in the fun and the fellowship of other industry members. Please find the separate Golf Registration form in this packet.


Neal Santangelo - Crown — Chairman Rick Clendenning - INX Joe Finan - Genesis Innovation Jack Knight - INX Renee Etiopio - INX Craig Eberts - First Transitions Dan Lombardo - INX Gary Silke - IMDA

Gene Basler - Anheuser Busch Gene Furey - IMDA Jonathan Ellaby - INX Mike Yavorski - PreCoat Metals Mike Masenior - Ameripro Kevin Richards - Bway Mark VonBokel - Metal Container Corp Jeff Radice - Meridian Arts & Graphics

Bob Lucich - Exal Ken Matyska - US Can Ted Nevins - Bway Bill Graue - Silgan John Freidman - Darco Metal Litho Michael Dizonno - Luscher America Jim Gilliam - Watson Standard Mark Novotney - Nordson

Sean Gribbon - Ross Air Systems Steve Kight - PPG Packaging Coatings Mark Finch - Silgan Containers Joe Runyan- JL Clark Mike Conover - PPG Industries Paul Krueger - Valspar

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